International Microelectronics Assembly and Packaging Society (IMAPS)
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Founded on merger of U-XN4075 - International Electronics Packaging Society (IEPS) and H-XD2490 - International Society for Hybrid Microelectronics (ISHM).
Advance and expand the use of microelectronics and microelectronic packaging.
Events2024-04-16 | Toyama City, Japan – Annual Conference
2023-10-02 | San Diego, CA USA – International Symposium on Microelectronics
83 past events available with paid subscription only.
ActivitiesAvailable with paid subscription only.
Officers: President; President-Elect; 1st Past President; Secretary; Treasurer; Regional Directors. Advisory Council.
LanguagesAvailable with paid subscription only.
StaffAvailable with paid subscription only.
FinanceAvailable with paid subscription only.
Relations with Non-Governmental OrganizationsAvailable with paid subscription only.
PublicationsAvailable with paid subscription only.
MembersAvailable with paid subscription only.
Type I ClassificationAvailable with paid subscription only.
Subjects *Available with paid subscription only.
UIA Org ID
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